2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings

The proceedings contain 32 papers. The topics discussed include: broadband performance of 110 GHz Interconnects built in HRSi-based membrane technology; skinny trace compensation methodology for high speed serial interface; 2-channel 2-layer inner-stack memory-module design for LPDDR2/3 dram; the role of impedance control in early detection of interconnect degradation using time domain reflectometry; electrothermal reduced equivalents of highly integrated systems with multi-port positive fraction foster expansion; method of moment solution of surface-volume-surface electric field integral equation for two-dimensional transmission lines of complex cross-sections; efficient inclusion of layered media green-functions in full-wave analysis of microstrips; electromagnetic modeling of non-uniform through-silicon via (TSV) interconnections; and tree-based sequential sampling algorithm for scalable macromodeling of high-speed systems.