The main objective of this work is the investigation on micro-nondestructive evaluation (micro-NDE) metrology for dimensional measurement and quality control of multi-material electronic devices consisting of chipset tablet assemblies. The micro-NDE approach is based on ultrasonic (US) sensors in pulse-echo testing mode applied according to the full-volume immersion scan method that provides for the US axial tomography of the chipset tablet. The thickness of the multi-material chipset tablet assembly layers was evaluated through micro-US 2½D geometrical measurements and the chipset tablet inter-layer integrity was critically assessed via micro feature US image analysis.
Micro-Ultrasonic Metrology of Multi-Material Electronic Devices / Teti, Roberto; P., De Santo. - STAMPA. - (2008), pp. 143-150.
Micro-Ultrasonic Metrology of Multi-Material Electronic Devices
TETI, ROBERTO;
2008
Abstract
The main objective of this work is the investigation on micro-nondestructive evaluation (micro-NDE) metrology for dimensional measurement and quality control of multi-material electronic devices consisting of chipset tablet assemblies. The micro-NDE approach is based on ultrasonic (US) sensors in pulse-echo testing mode applied according to the full-volume immersion scan method that provides for the US axial tomography of the chipset tablet. The thickness of the multi-material chipset tablet assembly layers was evaluated through micro-US 2½D geometrical measurements and the chipset tablet inter-layer integrity was critically assessed via micro feature US image analysis.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
