Epoxy nanocomposites with ceramic nanoparticles and liquid crystalline epoxy thermosets have been prepared and characterized with the aim to improve thermal conductivity of polymeric networks, without sacrificing processibility of reactive mixture and electrical insulation of final products. The influence of mesogenic liquid crystalline structure and fillers addition on thermal, mechanical and dielectric properties have been investigated by means of Differential Scanning Calorimetry (DSC), Dynamic-mechanical analysis (DMA) and volume resistivity. Morphological investigations by Optical Microscopy (OM) and Scanning Electron Microscopy (SEM) has been also performed. �� 2012 American Institute of Physics.

The influence of liquid crystalline structure and ceramic nanoparticles inclusion on thermal conductivity of epoxy based thermosets / A., Scamardella; S., Iacono; Carfagna, Cosimo; C., Ho; X., Kornmann; E., Amendola. - 1459:(2012), pp. 86-88. (Intervento presentato al convegno 6th International Conference on Times of Polymers (TOP) and Composites tenutosi a Ischia; Italy nel 10-14 June 2012) [10.1063/1.4738406].

The influence of liquid crystalline structure and ceramic nanoparticles inclusion on thermal conductivity of epoxy based thermosets

CARFAGNA, COSIMO;
2012

Abstract

Epoxy nanocomposites with ceramic nanoparticles and liquid crystalline epoxy thermosets have been prepared and characterized with the aim to improve thermal conductivity of polymeric networks, without sacrificing processibility of reactive mixture and electrical insulation of final products. The influence of mesogenic liquid crystalline structure and fillers addition on thermal, mechanical and dielectric properties have been investigated by means of Differential Scanning Calorimetry (DSC), Dynamic-mechanical analysis (DMA) and volume resistivity. Morphological investigations by Optical Microscopy (OM) and Scanning Electron Microscopy (SEM) has been also performed. �� 2012 American Institute of Physics.
2012
The influence of liquid crystalline structure and ceramic nanoparticles inclusion on thermal conductivity of epoxy based thermosets / A., Scamardella; S., Iacono; Carfagna, Cosimo; C., Ho; X., Kornmann; E., Amendola. - 1459:(2012), pp. 86-88. (Intervento presentato al convegno 6th International Conference on Times of Polymers (TOP) and Composites tenutosi a Ischia; Italy nel 10-14 June 2012) [10.1063/1.4738406].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11588/568574
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