The paper deals with the relationship between geometrical or topological entities of complex systems and the physics in which the systems are involved. In particular, the paper deepens the integration of thermal physics with geometrical constraints. Therefore, the results of the work could be used within the development of a 3D-multiphysical sketcher viz. a tool for the preliminary design of complex systems, characterized by the presence of one or more overlapping physics. Firstly, the model of Topologically & Technologically Related Surfaces (TTRS) is used and related Minimal Reference Geometrical Elements (MRGEs) and constraint conditions are implemented by means of Modelica language. Then, the implementation of new objects for MRGEs and constraint conditions are verified by applying them to a mechanical assembly. Finally, the integration of TTRS model within thermal physics is applied to the case of the designing for electronic boards.
Towards the integration of thermal physics and geometrical constraints for a 3D-multiphysical sketcher / Papa, Stefano; Patalano, Stanislao; Lanzotti, Antonio; Gerbino, S.; Choley, J. Y.. - (2015), pp. 248-252. (Intervento presentato al convegno 2015 IEEE International Symposium on Systems Engineering (ISSE) tenutosi a Rome, Italy nel 28th-30th September 2015) [10.1109/SysEng.2015.7302765].
Towards the integration of thermal physics and geometrical constraints for a 3D-multiphysical sketcher
PAPA, STEFANO;PATALANO, STANISLAO;LANZOTTI, ANTONIO;
2015
Abstract
The paper deals with the relationship between geometrical or topological entities of complex systems and the physics in which the systems are involved. In particular, the paper deepens the integration of thermal physics with geometrical constraints. Therefore, the results of the work could be used within the development of a 3D-multiphysical sketcher viz. a tool for the preliminary design of complex systems, characterized by the presence of one or more overlapping physics. Firstly, the model of Topologically & Technologically Related Surfaces (TTRS) is used and related Minimal Reference Geometrical Elements (MRGEs) and constraint conditions are implemented by means of Modelica language. Then, the implementation of new objects for MRGEs and constraint conditions are verified by applying them to a mechanical assembly. Finally, the integration of TTRS model within thermal physics is applied to the case of the designing for electronic boards.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
