A novel strategy to uncertainty quantification for heat conduction problems in electronic components and packages is proposed. Such an approach exploits parametric compact thermal models and polynomial spectral approximations for accurately and efficiently performing stochastic analysis by the Monte Carlo method. This methodology is able to deal with generic correlated random variations of material properties and geometrical details.
Three-steps approach to uncertainty quantification for electronic components and packages / Codecasa, Lorenzo; D'Alessandro, Vincenzo. - (2019). (Intervento presentato al convegno IEEE 25th international workshop on THERMal INvestigations of ICs and systems (THERMINIC) tenutosi a Lecco, Italy nel Sep. 2019) [10.1109/THERMINIC.2019.8923518].
Three-steps approach to uncertainty quantification for electronic components and packages
CODECASA, LORENZO;Vincenzo d'Alessandro
2019
Abstract
A novel strategy to uncertainty quantification for heat conduction problems in electronic components and packages is proposed. Such an approach exploits parametric compact thermal models and polynomial spectral approximations for accurately and efficiently performing stochastic analysis by the Monte Carlo method. This methodology is able to deal with generic correlated random variations of material properties and geometrical details.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
