This paper presents the Thermal Resistance and Impedance Calculator (TRIC) simulation tool, extending the TRAC tool, for the automatic extraction of thermal metrics of package families of electronic components in both stationary and transient conditions. The determination of the thermal metrics is speeded up by an accelerated solution algorithm, based on a novel projection-based approach, which, unlike previous techniques, allows dealing with parametric detailed thermal models of package families exhibiting generic non-Manhattan variations of geometries and meshes.
Thermal Resistance and Impedance Calculator (TRIC) / Codecasa, Lorenzo; De Viti, Francesca; Race, Salvatore; D'Alessandro, Vincenzo; Gualandris, Donata; Morelli, Arianna; Villa, Claudio M.. - (2019). (Intervento presentato al convegno IEEE 25th international workshop on THERMal INvestigations of ICs and systems (THERMINIC) tenutosi a Lecco, Italy nel Sep. 2019) [10.1109/THERMINIC.2019.8923605].
Thermal Resistance and Impedance Calculator (TRIC)
Lorenzo Codecasa;Vincenzo d'Alessandro;
2019
Abstract
This paper presents the Thermal Resistance and Impedance Calculator (TRIC) simulation tool, extending the TRAC tool, for the automatic extraction of thermal metrics of package families of electronic components in both stationary and transient conditions. The determination of the thermal metrics is speeded up by an accelerated solution algorithm, based on a novel projection-based approach, which, unlike previous techniques, allows dealing with parametric detailed thermal models of package families exhibiting generic non-Manhattan variations of geometries and meshes.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
