d'ALESSANDRO, VINCENZO
 Distribuzione geografica
Continente #
AS - Asia 7.635
NA - Nord America 6.517
EU - Europa 5.792
SA - Sud America 1.065
AF - Africa 114
Continente sconosciuto - Info sul continente non disponibili 9
OC - Oceania 6
Totale 21.138
Nazione #
US - Stati Uniti d'America 6.288
SG - Singapore 4.413
RU - Federazione Russa 2.712
CN - Cina 1.632
IT - Italia 1.046
BR - Brasile 889
HK - Hong Kong 600
VN - Vietnam 469
DE - Germania 460
UA - Ucraina 328
FI - Finlandia 260
IE - Irlanda 253
NL - Olanda 205
GB - Regno Unito 135
CA - Canada 120
KR - Corea 116
SE - Svezia 113
FR - Francia 91
IN - India 89
AR - Argentina 78
MX - Messico 73
JP - Giappone 53
BD - Bangladesh 45
PL - Polonia 43
ZA - Sudafrica 34
ID - Indonesia 33
ES - Italia 29
EC - Ecuador 25
TR - Turchia 24
TW - Taiwan 23
IQ - Iraq 22
MA - Marocco 21
VE - Venezuela 21
CH - Svizzera 19
BE - Belgio 17
AT - Austria 14
LT - Lituania 14
CO - Colombia 13
PE - Perù 12
PY - Paraguay 12
NP - Nepal 10
UZ - Uzbekistan 10
PK - Pakistan 9
SA - Arabia Saudita 9
AE - Emirati Arabi Uniti 7
CI - Costa d'Avorio 7
CZ - Repubblica Ceca 7
KE - Kenya 7
MY - Malesia 7
BG - Bulgaria 6
CY - Cipro 6
EU - Europa 6
KZ - Kazakistan 6
LB - Libano 6
UY - Uruguay 6
CL - Cile 5
DO - Repubblica Dominicana 5
HN - Honduras 5
KG - Kirghizistan 5
RO - Romania 5
AL - Albania 4
AU - Australia 4
DZ - Algeria 4
EG - Egitto 4
ET - Etiopia 4
IR - Iran 4
JM - Giamaica 4
PA - Panama 4
SY - Repubblica araba siriana 4
TH - Thailandia 4
TN - Tunisia 4
AZ - Azerbaigian 3
BA - Bosnia-Erzegovina 3
BB - Barbados 3
BO - Bolivia 3
CM - Camerun 3
CR - Costa Rica 3
DK - Danimarca 3
DM - Dominica 3
GE - Georgia 3
GR - Grecia 3
HR - Croazia 3
HU - Ungheria 3
JO - Giordania 3
KW - Kuwait 3
LU - Lussemburgo 3
MZ - Mozambico 3
RS - Serbia 3
SK - Slovacchia (Repubblica Slovacca) 3
TT - Trinidad e Tobago 3
TZ - Tanzania 3
ZM - Zambia 3
BW - Botswana 2
CW - ???statistics.table.value.countryCode.CW??? 2
LV - Lettonia 2
MD - Moldavia 2
ML - Mali 2
MW - Malawi 2
NG - Nigeria 2
OM - Oman 2
Totale 21.101
Città #
Singapore 2.011
Moscow 740
Chandler 714
Hong Kong 589
Ashburn 518
Beijing 495
Santa Clara 415
Dallas 409
Hefei 400
Jacksonville 291
Naples 275
Los Angeles 192
Amsterdam 188
Millbury 183
Princeton 180
Boston 178
Ho Chi Minh City 160
Munich 129
San Jose 129
Woodbridge 126
Napoli 121
Nanjing 112
Buffalo 106
Seoul 106
Wilmington 106
Hanoi 103
Des Moines 96
Fairfield 96
New York 82
São Paulo 82
Redondo Beach 75
Lawrence 60
Ottawa 60
Helsinki 51
Houston 46
The Dalles 46
Kronberg 44
Milan 41
Mexico City 40
Seattle 40
Turku 40
Tokyo 37
Chicago 35
Rio de Janeiro 35
Frankfurt am Main 34
Dublin 33
Warsaw 33
Nanchang 31
Shenyang 31
Brooklyn 30
Hebei 30
Chennai 29
Ann Arbor 25
Falkenstein 25
Boardman 23
Haiphong 23
Montreal 23
Belo Horizonte 22
Jiaxing 22
Norwalk 22
Rome 22
Atlanta 21
Johannesburg 21
Poplar 21
Pune 21
Redwood City 21
Biên Hòa 20
Brasília 20
Denver 20
Fidenza 20
Shanghai 20
Stockholm 19
Tianjin 19
Berlin 18
London 18
Changsha 17
Puglianello 17
Washington 17
Duncan 16
Manchester 15
Orem 15
Da Nang 14
San Francisco 14
Turin 14
Zurich 14
Porto Alegre 13
Toronto 13
Bacoli 12
Guangzhou 12
Ninh Bình 12
Orange 12
Phoenix 12
Campinas 11
Curitiba 11
Dearborn 11
Falls Church 11
Nuremberg 11
Goiânia 10
Quito 10
Sunnyvale 10
Totale 11.043
Nome #
Numerical analysis of the dynamic thermal behavior of RF bipolar transistors 183
Optimum module design II: Impact of parameter design spread 178
Circuito per il bypass attivo di sotto-pannelli fotovoltaici basato su un transistore bipolare operante in saturazione 165
A simple electrothermal compact model for SiC MPS diodes including the snapback mechanism 164
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 157
Dispositivi e sistemi fotovoltaici 137
SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs 136
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 127
Thermally induced current bifurcation in bipolar transistors 124
Electrothermal aware design of multichip SiC-based converters for e-mobility 124
Modellistica analitica e analisi numerica del comportamento termico di transistori bipolari con isolamento a trincea 123
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 123
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 123
Studio del fenomeno dell'innesco di instabilita' termiche in MOSFET di potenza per basse tensioni: modellistica analitica e verifica sperimentale 122
An ultrafast InP/InGaAsP optical modulator 121
Monitoring and diagnostics of PV plants by a wireless self-powered sensor for individual panels 121
Searching for a response: Feynman’s work on the amplifier theory 119
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 119
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 117
An approach to the measurement of shunt resistance of individual subcells in thin-film tandem devices 116
Si/SiGe:C and InP/GaAsSb heterojunction bipolar transistors for THz applications 116
Novel MPPT algorithm based on individual PV panel monitoring system 115
Effective electrothermal analysis of electronic devices and systems with parameterized macromodeling 115
Analisi degli effetti di auto-riscaldamento in transistori bipolari SOA 114
Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module 114
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 114
Achieving accuracy in modeling the temperature coefficient of threshold voltage in MOS transistors with uniform and horizontally nonuniform channel doping 113
A modified bypass circuit for improved hot spot reliability of solar panels subject to partial shading 113
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 112
Optimization of thermal vias design in PCB-based power circuits 111
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 110
Short-circuit failure mechanism of SiC power MOSFETs 110
Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level 110
Real-time temperature cycling estimation of IGBT power modules with power in-line measurements and compact thermal modeling 110
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 110
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 110
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 109
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 109
A novel simulation strategy for ultrafast InP/InGaAsP optoelectronic modulator analysis 108
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations 108
Dynamic electrothermal modeling of solar cells and modules 108
Influence of bumps height on electric field in double sided cooling power modules 107
Modellistica analitica e analisi numerica del comportamento termico di dispositivi trench SOI 106
Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology 106
Experimental DC extraction of the base resistance of bipolar transistors: Application to SiGe:C HBTs 106
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 106
Accurate yield prediction for PV plants in the presence of shadows due to fully arbitrary obstacles 105
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 105
Analytical modeling and numerical simulations of the thermal behavior of trench-isolated bipolar transistors on SOI substrates 104
Experimental comparison between an "information based" MPPT algorithm and standard P&O in both partial shading and uniform illumination 104
Matrix reduction tool for creating boundary condition independent dynamic compact thermal models 104
Thermal design of multifinger bipolar transistors 103
Dynamic electrothermal simulation of photovoltaic plants 103
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 103
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 101
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 101
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 100
Connecting MOR-based boundary condition independent compact thermal models 100
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 100
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 100
Searching for a response: The intriguing mystery of Feynman’s theoretical reference amplifier 100
High-temperature validated SiC power MOSFET model for flexible robustness analysis of multi-chip structures 99
Thermal effects in thin silicon dies: simulation and modeling 98
Thermal feedback networks for dynamic electrothermal simulations of devices and circuits: A critical perspective 98
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 98
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 98
Diagnosis of power losses in PV plants by means of UAV thermography 98
Electrothermal behavior of highly-symmetric three-finger bipolar transistors 97
Accurate analysis of small shadows effects on photovoltaic systems yield 97
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 97
Dynamic electrothermal analysis of bipolar devices and circuits relying on multi-port positive fraction Foster representation 96
Dynamic reconfiguration of solar systems for avoiding MPPT faults due to architectural partial shading 96
Advanced thermal resistance simulation of SiGe HBTs including backend cooling effect 96
Experimental validation of analytical models for through-PCB thermal vias 95
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 94
Defect detection in double-sided cooled power modules by structure function 93
Electrothermal issues in 4H-SiC 600 V Schottky diodes in forward mode: Experimental characterization, numerical simulation and analytical modeling 93
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 93
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 93
Thermal design of fully-isolated bipolar transistors 92
3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions 92
A power line communication on DC bus with photovoltaic strings 92
Accurate maximum power tracking in photovoltaic systems affected by partial shading 92
Reliability of high-speed SiGe:C HBT under electrical stress close to the SOA limit 92
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 90
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 90
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 90
Advanced thermal simulation of SiGe:C HBTs including back-end-of-line 89
Evaluation of vertical mechanical displacement in SiC-based power modules 89
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 88
Analytical model for thermal instability of low voltage power MOS and S.O.A. in pulse operation 88
Theory of electrothermal behavior of bipolar transistors: Part II - Two-finger devices 88
Electrothermal issues in 4H-SiC 600 V Schottky diodes in forward mode: Experimental characterization, numerical simulations and analytical modeling 88
Impact of layout and technology parameters on the thermal resistance of SiGe:C HBTs 88
A wireless sensor network for the monitoring of large PV plants 88
Tecniche di identificazione di circuiti equivalenti per il macro-modeling elettrotermico 88
Study of the thermal behavior of double-sided cooled power modules 88
Dynamic electrothermal macromodeling: An application to signal integrity analysis in highly integrated electronic systems 87
Calibration of detailed thermal models by parametric dynamic compact thermal models 87
On-line junction temperature monitoring of switching devices with dynamic compact thermal models extracted with model order reduction 87
Totale 10.704
Categoria #
all - tutte 74.703
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 74.703


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021385 0 0 0 0 0 0 120 45 98 17 54 51
2021/20221.317 16 4 7 19 20 52 69 69 243 58 188 572
2022/20231.646 264 121 47 158 194 185 10 148 239 194 62 24
2023/20241.354 48 178 194 134 199 125 38 90 23 25 210 90
2024/20256.728 383 418 32 62 268 270 705 456 491 446 2.437 760
2025/20267.961 1.386 1.012 1.493 1.298 1.989 578 205 0 0 0 0 0
Totale 22.065