IRIS
CODECASA, LORENZO
 Distribuzione geografica
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Continente #
AS - Asia 2.206
NA - Nord America 1.692
EU - Europa 1.179
SA - Sud America 226
AF - Africa 28
Continente sconosciuto - Info sul continente non disponibili 4
OC - Oceania 1
Totale 5.336
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Nazione #
US - Stati Uniti d'America 1.639
SG - Singapore 1.063
RU - Federazione Russa 532
CN - Cina 494
IT - Italia 301
VN - Vietnam 277
BR - Brasile 186
HK - Hong Kong 106
FR - Francia 98
DE - Germania 78
JP - Giappone 71
KR - Corea 56
NL - Olanda 29
CA - Canada 27
BD - Bangladesh 25
FI - Finlandia 25
GB - Regno Unito 25
IN - India 23
IE - Irlanda 19
MX - Messico 19
PL - Polonia 18
TW - Taiwan 16
AR - Argentina 14
IQ - Iraq 14
SE - Svezia 14
TH - Thailandia 9
MA - Marocco 8
TR - Turchia 8
ZA - Sudafrica 8
ES - Italia 6
UA - Ucraina 6
VE - Venezuela 6
ID - Indonesia 5
AE - Emirati Arabi Uniti 4
AT - Austria 4
BE - Belgio 4
CH - Svizzera 4
CL - Cile 4
CO - Colombia 4
EU - Europa 4
JO - Giordania 4
LT - Lituania 4
PH - Filippine 4
PK - Pakistan 4
UZ - Uzbekistan 4
BO - Bolivia 3
CI - Costa d'Avorio 3
PE - Perù 3
SA - Arabia Saudita 3
UY - Uruguay 3
BB - Barbados 2
BH - Bahrain 2
CZ - Repubblica Ceca 2
DK - Danimarca 2
EC - Ecuador 2
IR - Iran 2
KE - Kenya 2
KZ - Kazakistan 2
LB - Libano 2
RO - Romania 2
SK - Slovacchia (Repubblica Slovacca) 2
YE - Yemen 2
AL - Albania 1
AU - Australia 1
AZ - Azerbaigian 1
CM - Camerun 1
DO - Repubblica Dominicana 1
EG - Egitto 1
ET - Etiopia 1
HN - Honduras 1
HU - Ungheria 1
IL - Israele 1
IS - Islanda 1
KG - Kirghizistan 1
KN - Saint Kitts e Nevis 1
LU - Lussemburgo 1
MQ - Martinica 1
MY - Malesia 1
MZ - Mozambico 1
NP - Nepal 1
PR - Porto Rico 1
PS - Palestinian Territory 1
PY - Paraguay 1
RE - Reunion 1
TN - Tunisia 1
ZM - Zambia 1
Totale 5.336
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Città #
Singapore 495
San Jose 224
Dallas 191
Hefei 177
Moscow 130
Beijing 123
Ashburn 120
Chandler 99
Hong Kong 96
Santa Clara 96
Naples 93
Ho Chi Minh City 77
Hanoi 68
Tokyo 56
Lauterbourg 50
Seoul 46
Fairfield 45
The Dalles 42
Los Angeles 41
Munich 37
New York 32
Lawrence 30
Amsterdam 28
Boston 28
Buffalo 24
Napoli 24
Millbury 23
São Paulo 22
Des Moines 19
Redondo Beach 19
Milan 18
Da Nang 16
Frankfurt am Main 16
Warsaw 15
Haiphong 14
Chicago 12
Brooklyn 11
Dublin 11
Rio de Janeiro 11
Duncan 10
Helsinki 10
Mexico City 10
Ottawa 9
Princeton 9
Seattle 9
Nanjing 8
Wilmington 8
Biên Hòa 7
Dearborn 7
Falkenstein 7
Hsinchu 7
Montreal 7
Redwood City 7
Stockholm 7
Bacoli 6
Denver 6
Fidenza 6
London 6
Orem 6
Rome 6
Shanghai 6
Turku 6
Atlanta 5
Augusta 5
Baghdad 5
Belo Horizonte 5
Can Tho 5
Council Bluffs 5
Johannesburg 5
Lappeenranta 5
Palermo 5
Porto Alegre 5
San Francisco 5
Turin 5
Amman 4
Brasília 4
Chennai 4
Hebei 4
Houston 4
Nuremberg 4
Osaka 4
Paliano 4
Pomigliano d'Arco 4
Puglianello 4
Roubaix 4
San Cipriano Picentino 4
Santiago 4
Agadir 3
Amalfi 3
Boydton 3
Bragança Paulista 3
Braunschweig 3
Campinas 3
Catania 3
Caxias do Sul 3
Central 3
Charleston 3
Curitiba 3
East Brunswick 3
Goiânia 3
Totale 3.000
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Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 175
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 142
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 133
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 133
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 130
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 129
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 129
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 128
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 126
Connecting MOR-based boundary condition independent compact thermal models 124
Dynamic electrothermal modeling of solar cells and modules 121
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 120
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 119
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 117
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 116
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 115
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 115
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 115
Defect detection in double-sided cooled power modules by structure function 114
Study of the thermal behavior of double-sided cooled power modules 112
Delphi-like dynamical compact thermal models using model order reduction 111
Calibration of detailed thermal models by parametric dynamic compact thermal models 110
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 103
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 101
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 99
TRIC: A thermal resistance and impedance calculator for electronic packages 99
Determining the contribution of spatial sub-regions to structure functions 99
TRAC: A Thermal Resistance Advanced Calculator for electronics packages 96
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps 95
Three-steps approach to uncertainty quantification for electronic components and packages 90
Novel approach to the extraction of Delphi-like boundary-condition-independent compact thermal models of planar transformer devices 90
Boundary condition independent compact thermal models enhanced by contour elements 89
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 88
Thermal Resistance and Impedance Calculator (TRIC) 86
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization 86
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 82
Fast error-bounded MOR-based approximation of heat conduction problems in electronics 82
A cost-driven analysis of thermal performance in power modules 79
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 79
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 79
Enhancing electrical ruggedness in double-sided cooled power modules 78
Practical thermal modeling of planar magnetic component devices 77
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 75
Thermal Resistance Advanced Calculator (TRAC) 75
Experimental characterization of MOR-based and Delphi-like BCI DCTMs 75
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 73
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 71
Optimum module design I: Electrothermal 69
Algorithm for establishing the dependence of structure functions on spatial distributions of thermal properties 67
Structure curve representation of dynamic thermal multi-ports 65
Compact electro-thermal models for integrated systems 58
Altering MOR-based BCI CTMs into Delphi-like BCI CTMs 57
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 56
Galerkin’s projection framework for BCI CTMs – Part I: Extended FANTASTIC approach 56
Thermal modeling of BGA package families using the thermal resistance and impedance calculator (TRIC) 53
Towards the extension of TRIC for thermo-mechanical analysis 51
Novel approach to the extraction of sparse nonlinear dynamic compact thermal multi-ports 46
TONIC: TOol for nonlinear BCI CTMs of Integrated Circuits 40
Totale 5.498
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Categoria #
all - tutte 18.614
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 18.614
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022190 6 0 0 2 4 7 20 17 11 0 30 93
2022/2023270 42 16 13 13 28 28 3 36 41 28 17 5
2023/2024337 10 45 76 29 76 5 12 10 7 9 44 14
2024/20251.518 67 109 0 13 44 74 118 118 135 94 570 176
2025/20262.800 347 222 431 309 408 143 224 217 242 156 50 51
2026/202745 45 0 0 0 0 0 0 0 0 0 0 0
Totale 5.498