CODECASA, LORENZO
 Distribuzione geografica
Continente #
NA - Nord America 615
EU - Europa 331
AS - Asia 220
Continente sconosciuto - Info sul continente non disponibili 4
AF - Africa 2
SA - Sud America 1
Totale 1.173
Nazione #
US - Stati Uniti d'America 606
IT - Italia 225
SG - Singapore 136
CN - Cina 46
NL - Olanda 22
DE - Germania 18
FR - Francia 17
IE - Irlanda 17
JP - Giappone 15
CA - Canada 9
HK - Hong Kong 9
SE - Svezia 7
FI - Finlandia 6
RU - Federazione Russa 6
TW - Taiwan 6
EU - Europa 4
GB - Regno Unito 4
KR - Corea 3
TH - Thailandia 3
BE - Belgio 2
RO - Romania 2
UA - Ucraina 2
BR - Brasile 1
CH - Svizzera 1
CI - Costa d'Avorio 1
CM - Camerun 1
IN - India 1
IR - Iran 1
PL - Polonia 1
SK - Slovacchia (Repubblica Slovacca) 1
Totale 1.173
Città #
Singapore 116
Chandler 95
Naples 66
Santa Clara 61
Fairfield 41
Lawrence 29
Boston 24
Napoli 23
Millbury 22
Amsterdam 21
Des Moines 18
Beijing 15
Ashburn 14
Milan 14
Duncan 10
Dublin 9
Princeton 9
Ottawa 8
Dearborn 7
Nanjing 7
Redwood City 7
Fidenza 6
Hong Kong 6
Wilmington 6
Frankfurt am Main 5
Palermo 5
Shanghai 5
Tokyo 5
Hebei 4
Osaka 4
Paliano 4
San Cipriano Picentino 4
Amalfi 3
Braunschweig 3
Dallas 3
Monterenzio 3
Nanchang 3
Saint-Martin-d'Hères 3
Altamura 2
Avigliana 2
Bolton 2
Boulogne-Billancourt 2
Cambridge 2
Castelfranco di Sotto 2
Catania 2
Cesa 2
Chelles 2
Collegno 2
Colombes 2
Grenoble 2
Kronberg 2
Lat Krabang 2
Leuven 2
Lipari 2
New Taipei City 2
Portico Di Caserta 2
Puglianello 2
Riano 2
Rome 2
Seattle 2
Turin 2
Abbiategrasso 1
Acerra 1
Ardabil 1
Berlin 1
Bernareggio 1
Brasov 1
Bratislava 1
Caltanissetta 1
Campagna 1
Castiglion Fiorentino 1
Catanzaro 1
Central 1
Chengdu 1
Chiang Mai 1
Chicago 1
Columbus 1
Decatur 1
Dresden 1
Empoli 1
Fort St. James 1
Frattamaggiore 1
Gdynia 1
Guangzhou 1
Helsinki 1
Houston 1
Hyderabad 1
Jiaxing 1
La Spezia 1
Lappeenranta 1
Mannheim 1
Moniga del Garda 1
Munich 1
Nagoya 1
Neubiberg 1
Norwalk 1
Orange 1
Paderno Dugnano 1
Padova 1
Pago Veiano 1
Totale 773
Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 103
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 76
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 61
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 55
Dynamic electrothermal modeling of solar cells and modules 51
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps 47
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 40
Connecting MOR-based boundary condition independent compact thermal models 38
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 38
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 37
Calibration of detailed thermal models by parametric dynamic compact thermal models 36
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 36
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 34
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 34
Algorithm for establishing the dependence of structure functions on spatial distributions of thermal properties 31
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 31
Delphi-like dynamical compact thermal models using model order reduction 27
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 27
Altering MOR-based BCI CTMs into Delphi-like BCI CTMs 25
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 23
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 22
TRAC: A Thermal Resistance Advanced Calculator for electronics packages 22
TRIC: A thermal resistance and impedance calculator for electronic packages 22
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 21
Thermal Resistance and Impedance Calculator (TRIC) 21
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization 20
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 20
Study of the thermal behavior of double-sided cooled power modules 19
Compact electro-thermal models for integrated systems 19
Boundary condition independent compact thermal models enhanced by contour elements 18
Optimum module design I: Electrothermal 18
Practical thermal modeling of planar magnetic component devices 17
Three-steps approach to uncertainty quantification for electronic components and packages 17
Thermal modeling of BGA package families using the thermal resistance and impedance calculator (TRIC) 17
Experimental characterization of MOR-based and Delphi-like BCI DCTMs 15
Towards the extension of TRIC for thermo-mechanical analysis 15
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 14
Thermal Resistance Advanced Calculator (TRAC) 14
Galerkin’s projection framework for BCI CTMs – Part I: Extended FANTASTIC approach 14
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 13
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 12
Novel approach to the extraction of Delphi-like boundary-condition-independent compact thermal models of planar transformer devices 12
TONIC: TOol for nonlinear BCI CTMs of Integrated Circuits 12
Defect detection in double-sided cooled power modules by structure function 11
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 10
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 10
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 10
Structure curve representation of dynamic thermal multi-ports 9
Determining the contribution of spatial sub-regions to structure functions 9
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 7
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 5
Totale 1.315
Categoria #
all - tutte 7.468
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 7.468


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202095 0 0 0 0 50 5 4 5 5 8 13 5
2020/202173 6 1 4 2 3 5 18 8 4 0 5 17
2021/2022185 6 0 0 2 4 7 20 17 11 0 28 90
2022/2023262 41 15 11 13 28 27 3 36 40 26 17 5
2023/2024316 10 40 72 28 73 5 8 10 5 9 43 13
2024/2025229 65 108 0 13 43 0 0 0 0 0 0 0
Totale 1.315