IRIS
CODECASA, LORENZO
 Distribuzione geografica
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Continente #
AS - Asia 2.199
NA - Nord America 1.635
EU - Europa 1.173
SA - Sud America 220
AF - Africa 28
Continente sconosciuto - Info sul continente non disponibili 4
OC - Oceania 1
Totale 5.260
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Nazione #
US - Stati Uniti d'America 1.586
SG - Singapore 1.063
RU - Federazione Russa 532
CN - Cina 491
IT - Italia 296
VN - Vietnam 277
BR - Brasile 181
HK - Hong Kong 106
FR - Francia 98
DE - Germania 78
JP - Giappone 71
KR - Corea 56
NL - Olanda 29
CA - Canada 25
FI - Finlandia 25
GB - Regno Unito 25
IN - India 23
BD - Bangladesh 22
IE - Irlanda 19
MX - Messico 18
PL - Polonia 18
TW - Taiwan 16
AR - Argentina 14
IQ - Iraq 14
SE - Svezia 14
TH - Thailandia 9
MA - Marocco 8
TR - Turchia 8
ZA - Sudafrica 8
ES - Italia 6
UA - Ucraina 6
VE - Venezuela 6
ID - Indonesia 5
AE - Emirati Arabi Uniti 4
AT - Austria 4
BE - Belgio 4
CH - Svizzera 4
CL - Cile 4
EU - Europa 4
JO - Giordania 4
LT - Lituania 4
PH - Filippine 4
PK - Pakistan 4
UZ - Uzbekistan 4
BO - Bolivia 3
CI - Costa d'Avorio 3
CO - Colombia 3
PE - Perù 3
UY - Uruguay 3
BB - Barbados 2
BH - Bahrain 2
CZ - Repubblica Ceca 2
DK - Danimarca 2
EC - Ecuador 2
IR - Iran 2
KE - Kenya 2
KZ - Kazakistan 2
LB - Libano 2
RO - Romania 2
SA - Arabia Saudita 2
SK - Slovacchia (Repubblica Slovacca) 2
YE - Yemen 2
AL - Albania 1
AU - Australia 1
AZ - Azerbaigian 1
CM - Camerun 1
DO - Repubblica Dominicana 1
EG - Egitto 1
ET - Etiopia 1
HN - Honduras 1
IL - Israele 1
IS - Islanda 1
KG - Kirghizistan 1
KN - Saint Kitts e Nevis 1
LU - Lussemburgo 1
MQ - Martinica 1
MY - Malesia 1
MZ - Mozambico 1
NP - Nepal 1
PS - Palestinian Territory 1
PY - Paraguay 1
RE - Reunion 1
TN - Tunisia 1
ZM - Zambia 1
Totale 5.260
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Città #
Singapore 495
San Jose 224
Dallas 190
Hefei 177
Moscow 130
Beijing 123
Ashburn 100
Chandler 99
Hong Kong 96
Santa Clara 94
Naples 93
Ho Chi Minh City 77
Hanoi 68
Tokyo 56
Lauterbourg 50
Seoul 46
Fairfield 45
The Dalles 42
Los Angeles 41
Munich 37
New York 32
Lawrence 30
Amsterdam 28
Boston 28
Buffalo 24
Napoli 24
Millbury 23
Des Moines 19
Redondo Beach 19
São Paulo 19
Milan 17
Da Nang 16
Frankfurt am Main 16
Warsaw 15
Haiphong 14
Brooklyn 11
Chicago 11
Dublin 11
Rio de Janeiro 11
Duncan 10
Helsinki 10
Mexico City 10
Ottawa 9
Princeton 9
Seattle 9
Nanjing 8
Wilmington 8
Biên Hòa 7
Dearborn 7
Falkenstein 7
Hsinchu 7
Montreal 7
Redwood City 7
Stockholm 7
Bacoli 6
Denver 6
Fidenza 6
Orem 6
Shanghai 6
Turku 6
Baghdad 5
Belo Horizonte 5
Can Tho 5
Johannesburg 5
Lappeenranta 5
London 5
Palermo 5
Porto Alegre 5
Rome 5
San Francisco 5
Turin 5
Amman 4
Atlanta 4
Augusta 4
Brasília 4
Chennai 4
Hebei 4
Houston 4
Nuremberg 4
Osaka 4
Paliano 4
Pomigliano d'Arco 4
Puglianello 4
Roubaix 4
San Cipriano Picentino 4
Santiago 4
Agadir 3
Amalfi 3
Boydton 3
Bragança Paulista 3
Braunschweig 3
Campinas 3
Catania 3
Caxias do Sul 3
Central 3
Charleston 3
Curitiba 3
East Brunswick 3
Goiânia 3
Guangzhou 3
Totale 2.966
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Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 174
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 142
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 132
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 132
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 129
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 129
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 128
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 126
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 125
Connecting MOR-based boundary condition independent compact thermal models 123
Dynamic electrothermal modeling of solar cells and modules 121
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 118
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 118
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 116
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 116
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 115
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 115
Defect detection in double-sided cooled power modules by structure function 114
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 113
Study of the thermal behavior of double-sided cooled power modules 109
Calibration of detailed thermal models by parametric dynamic compact thermal models 108
Delphi-like dynamical compact thermal models using model order reduction 107
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 102
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 101
TRIC: A thermal resistance and impedance calculator for electronic packages 98
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 97
Determining the contribution of spatial sub-regions to structure functions 97
TRAC: A Thermal Resistance Advanced Calculator for electronics packages 95
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps 94
Three-steps approach to uncertainty quantification for electronic components and packages 90
Boundary condition independent compact thermal models enhanced by contour elements 87
Novel approach to the extraction of Delphi-like boundary-condition-independent compact thermal models of planar transformer devices 87
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 87
Thermal Resistance and Impedance Calculator (TRIC) 85
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 82
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization 82
Fast error-bounded MOR-based approximation of heat conduction problems in electronics 80
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 79
Enhancing electrical ruggedness in double-sided cooled power modules 77
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 77
Practical thermal modeling of planar magnetic component devices 75
Thermal Resistance Advanced Calculator (TRAC) 75
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 74
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 73
A cost-driven analysis of thermal performance in power modules 73
Experimental characterization of MOR-based and Delphi-like BCI DCTMs 73
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 70
Optimum module design I: Electrothermal 69
Algorithm for establishing the dependence of structure functions on spatial distributions of thermal properties 65
Structure curve representation of dynamic thermal multi-ports 60
Galerkin’s projection framework for BCI CTMs – Part I: Extended FANTASTIC approach 56
Compact electro-thermal models for integrated systems 56
Altering MOR-based BCI CTMs into Delphi-like BCI CTMs 55
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 54
Thermal modeling of BGA package families using the thermal resistance and impedance calculator (TRIC) 52
Towards the extension of TRIC for thermo-mechanical analysis 50
Novel approach to the extraction of sparse nonlinear dynamic compact thermal multi-ports 46
TONIC: TOol for nonlinear BCI CTMs of Integrated Circuits 39
Totale 5.422
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Categoria #
all - tutte 17.873
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 17.873
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202120 0 0 0 0 0 0 0 0 0 0 0 20
2021/2022190 6 0 0 2 4 7 20 17 11 0 30 93
2022/2023270 42 16 13 13 28 28 3 36 41 28 17 5
2023/2024337 10 45 76 29 76 5 12 10 7 9 44 14
2024/20251.518 67 109 0 13 44 74 118 118 135 94 570 176
2025/20262.769 347 222 431 309 408 143 224 217 242 156 50 20
Totale 5.422