IRIS
CATALANO, ANTONIO PIO
 Distribuzione geografica
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Continente #
AS - Asia 2.933
NA - Nord America 2.321
EU - Europa 1.501
SA - Sud America 307
AF - Africa 40
OC - Oceania 3
Continente sconosciuto - Info sul continente non disponibili 1
Totale 7.106
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Nazione #
US - Stati Uniti d'America 2.236
SG - Singapore 1.351
CN - Cina 675
RU - Federazione Russa 600
IT - Italia 476
VN - Vietnam 362
BR - Brasile 256
FR - Francia 120
HK - Hong Kong 108
DE - Germania 105
BD - Bangladesh 103
KR - Corea 92
JP - Giappone 76
CA - Canada 44
GB - Regno Unito 39
IN - India 33
FI - Finlandia 30
MX - Messico 28
NL - Olanda 26
PL - Polonia 20
AR - Argentina 19
IE - Irlanda 18
TW - Taiwan 18
IQ - Iraq 16
TH - Thailandia 14
BE - Belgio 12
SE - Svezia 12
ID - Indonesia 11
MA - Marocco 11
ES - Italia 10
PK - Pakistan 10
ZA - Sudafrica 10
EC - Ecuador 8
CH - Svizzera 7
TR - Turchia 7
AE - Emirati Arabi Uniti 6
JO - Giordania 6
LT - Lituania 6
PH - Filippine 6
VE - Venezuela 6
CO - Colombia 5
MY - Malesia 5
NP - Nepal 5
AT - Austria 4
AZ - Azerbaigian 4
UZ - Uzbekistan 4
CI - Costa d'Avorio 3
DO - Repubblica Dominicana 3
ET - Etiopia 3
HU - Ungheria 3
IR - Iran 3
KE - Kenya 3
KZ - Kazakistan 3
PE - Perù 3
PY - Paraguay 3
SA - Arabia Saudita 3
UA - Ucraina 3
AU - Australia 2
BO - Bolivia 2
CL - Cile 2
CY - Cipro 2
DK - Danimarca 2
KG - Kirghizistan 2
LB - Libano 2
NG - Nigeria 2
RO - Romania 2
SK - Slovacchia (Repubblica Slovacca) 2
SY - Repubblica araba siriana 2
UY - Uruguay 2
AL - Albania 1
BA - Bosnia-Erzegovina 1
BJ - Benin 1
BW - Botswana 1
CR - Costa Rica 1
DM - Dominica 1
DZ - Algeria 1
EG - Egitto 1
EU - Europa 1
GE - Georgia 1
GT - Guatemala 1
GY - Guiana 1
HN - Honduras 1
KN - Saint Kitts e Nevis 1
LI - Liechtenstein 1
LU - Lussemburgo 1
MN - Mongolia 1
MQ - Martinica 1
OM - Oman 1
PA - Panama 1
PG - Papua Nuova Guinea 1
PR - Porto Rico 1
RE - Reunion 1
SV - El Salvador 1
TN - Tunisia 1
TT - Trinidad e Tobago 1
TZ - Tanzania 1
YE - Yemen 1
ZM - Zambia 1
Totale 7.106
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Città #
Singapore 647
Dallas 369
San Jose 343
Hefei 301
Ashburn 188
Moscow 163
Naples 153
Beijing 137
Chandler 129
Ho Chi Minh City 105
Santa Clara 105
Hong Kong 94
Hanoi 88
Seoul 81
Tokyo 70
Lauterbourg 65
Los Angeles 63
The Dalles 60
Fairfield 56
Munich 49
Napoli 43
New York 40
Buffalo 34
Boston 32
Lawrence 31
São Paulo 30
Milan 23
Redondo Beach 23
Amsterdam 22
Rome 20
Da Nang 19
Des Moines 18
Dublin 18
Frankfurt am Main 17
Millbury 17
Chicago 15
Haiphong 15
Montreal 15
Warsaw 15
Mexico City 14
Seattle 14
Rio de Janeiro 13
Turku 13
Bacoli 12
Council Bluffs 11
Atlanta 10
Brooklyn 10
Helsinki 10
Chennai 9
Falkenstein 9
Nanjing 9
Orem 9
Shanghai 9
Biên Hòa 8
Dearborn 8
Denver 8
Houston 8
Phoenix 8
Poplar 8
San Francisco 8
Turin 8
Baghdad 7
Belo Horizonte 7
Lappeenranta 7
Nuremberg 7
Ottawa 7
Pomigliano d'Arco 7
Wilmington 7
Acerra 6
Amman 6
Augusta 6
Can Tho 6
Hsinchu 6
Johannesburg 6
London 6
Princeton 6
Puglianello 6
Brasília 5
Brussels 5
Catania 5
Curitiba 5
Dresden 5
Düsseldorf 5
New Taipei City 5
Pagani 5
Porto Alegre 5
Roubaix 5
São José do Rio Preto 5
Zurich 5
Baku 4
Charlotte 4
Giugliano in Campania 4
Goiânia 4
Hyderabad 4
Hải Dương 4
Karachi 4
Manchester 4
Milwaukee 4
Mumbai 4
Phuket 4
Totale 4.136
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Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 175
Electrothermal aware design of multichip SiC-based converters for e-mobility 151
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 151
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 146
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 139
Electro-thermal circuit models of PhotoVoltaic cells subjected to optical degradation phenomena 137
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 137
Influence of bumps height on electric field in double sided cooling power modules 133
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 133
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 130
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 129
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 129
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 128
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 128
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 126
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 126
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 126
Optimization of thermal vias design in PCB-based power circuits 125
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 120
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 119
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 119
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 118
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 117
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 117
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 116
Diagnosis of power losses in PV plants by means of UAV thermography 116
Experimental validation of analytical models for through-PCB thermal vias 116
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 115
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 115
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 115
Defect detection in double-sided cooled power modules by structure function 114
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 113
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 113
Study of the thermal behavior of double-sided cooled power modules 112
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part II: Approaches based on intersection points 111
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 110
Evaluation of vertical mechanical displacement in SiC-based power modules 108
In-depth analysis of the electrical ruggedness of double-sided cooled power modules 107
Validation of thermometer-based techniques to experimentally extract the impact of nonlinear thermal effects on the thermal resistance of bipolar transistors 105
A priori error bound for moment matching approximants of thermal models 105
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 103
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 101
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 99
Determining the contribution of spatial sub-regions to structure functions 99
Thermal management solutions for a lightweight 3L GaN inverter 97
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 97
TCAD-based investigation of a 3.3 kV planar SiC MOSFET: BV-RON trade-off optimization 95
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps 95
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 91
Boundary condition independent compact thermal models enhanced by contour elements 89
Out-of-SOA performance in 3.3 kV SiC MOSFETs: Comparison between planar and quasi-planar trench 88
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 88
A technique for the in-situ experimental extraction of the thermal impedance of power devices 85
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 82
Fast error-bounded MOR-based approximation of heat conduction problems in electronics 82
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study 81
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 80
A cost-driven analysis of thermal performance in power modules 79
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 79
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 79
Enhancing electrical ruggedness in double-sided cooled power modules 78
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 75
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 73
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 71
Optimum module design I: Electrothermal 69
Structure curve representation of dynamic thermal multi-ports 65
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 56
Novel approach to the extraction of sparse nonlinear dynamic compact thermal multi-ports 46
The Hidden Short-Term Electro-Thermal–Optical Feedback Loop in Circuit-Level Modeling of PV Hot-Spots 27
Totale 7.299
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Categoria #
all - tutte 22.721
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 22.721
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022204 3 0 0 3 7 7 22 29 4 1 34 94
2022/2023311 38 19 16 11 40 42 5 34 58 25 15 8
2023/2024396 14 42 85 38 103 5 14 10 9 8 51 17
2024/20251.917 82 132 8 15 51 101 144 140 138 129 700 277
2025/20264.093 464 312 670 516 555 211 290 300 282 232 116 145
2026/202793 93 0 0 0 0 0 0 0 0 0 0 0
Totale 7.299