IRIS
CATALANO, ANTONIO PIO
 Distribuzione geografica
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Continente #
AS - Asia 2.817
NA - Nord America 2.123
EU - Europa 1.444
SA - Sud America 303
AF - Africa 40
OC - Oceania 3
Continente sconosciuto - Info sul continente non disponibili 1
Totale 6.731
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Nazione #
US - Stati Uniti d'America 2.054
SG - Singapore 1.341
CN - Cina 660
RU - Federazione Russa 600
IT - Italia 422
VN - Vietnam 361
BR - Brasile 252
FR - Francia 120
HK - Hong Kong 106
DE - Germania 105
KR - Corea 92
JP - Giappone 75
GB - Regno Unito 37
IN - India 33
CA - Canada 32
FI - Finlandia 30
MX - Messico 27
NL - Olanda 26
BD - Bangladesh 20
PL - Polonia 20
AR - Argentina 19
IE - Irlanda 18
TW - Taiwan 18
IQ - Iraq 16
TH - Thailandia 13
BE - Belgio 12
SE - Svezia 12
ID - Indonesia 11
MA - Marocco 11
ES - Italia 10
PK - Pakistan 10
ZA - Sudafrica 10
EC - Ecuador 8
CH - Svizzera 7
TR - Turchia 7
JO - Giordania 6
LT - Lituania 6
VE - Venezuela 6
CO - Colombia 5
MY - Malesia 5
NP - Nepal 5
PH - Filippine 5
AE - Emirati Arabi Uniti 4
AT - Austria 4
AZ - Azerbaigian 4
UZ - Uzbekistan 4
CI - Costa d'Avorio 3
DO - Repubblica Dominicana 3
ET - Etiopia 3
IR - Iran 3
KE - Kenya 3
KZ - Kazakistan 3
PE - Perù 3
PY - Paraguay 3
SA - Arabia Saudita 3
UA - Ucraina 3
AU - Australia 2
BO - Bolivia 2
CL - Cile 2
CY - Cipro 2
DK - Danimarca 2
HU - Ungheria 2
KG - Kirghizistan 2
LB - Libano 2
NG - Nigeria 2
RO - Romania 2
SK - Slovacchia (Repubblica Slovacca) 2
SY - Repubblica araba siriana 2
UY - Uruguay 2
AL - Albania 1
BA - Bosnia-Erzegovina 1
BJ - Benin 1
BW - Botswana 1
CR - Costa Rica 1
DM - Dominica 1
DZ - Algeria 1
EG - Egitto 1
EU - Europa 1
GE - Georgia 1
GY - Guiana 1
HN - Honduras 1
LI - Liechtenstein 1
LU - Lussemburgo 1
MN - Mongolia 1
MQ - Martinica 1
OM - Oman 1
PA - Panama 1
PG - Papua Nuova Guinea 1
PR - Porto Rico 1
RE - Reunion 1
SV - El Salvador 1
TN - Tunisia 1
TZ - Tanzania 1
YE - Yemen 1
ZM - Zambia 1
Totale 6.731
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Città #
Singapore 643
Dallas 365
San Jose 324
Hefei 301
Moscow 163
Ashburn 150
Naples 146
Beijing 137
Chandler 128
Ho Chi Minh City 105
Santa Clara 103
Hong Kong 92
Hanoi 88
Seoul 81
Tokyo 70
Lauterbourg 65
The Dalles 60
Fairfield 56
Los Angeles 55
Munich 49
Napoli 43
Boston 32
Lawrence 31
New York 30
Buffalo 28
São Paulo 28
Redondo Beach 23
Amsterdam 22
Milan 20
Da Nang 19
Des Moines 18
Dublin 18
Frankfurt am Main 17
Millbury 17
Haiphong 15
Warsaw 15
Mexico City 14
Seattle 14
Rio de Janeiro 13
Turku 13
Bacoli 12
Chicago 12
Montreal 11
Brooklyn 10
Helsinki 10
Atlanta 9
Chennai 9
Falkenstein 9
Nanjing 9
Biên Hòa 8
Denver 8
Houston 8
Orem 8
Poplar 8
Rome 8
Shanghai 8
Baghdad 7
Council Bluffs 7
Dearborn 7
Lappeenranta 7
Nuremberg 7
Ottawa 7
Phoenix 7
Pomigliano d'Arco 7
Acerra 6
Amman 6
Belo Horizonte 6
Can Tho 6
Hsinchu 6
Johannesburg 6
Princeton 6
Puglianello 6
San Francisco 6
Turin 6
Wilmington 6
Brasília 5
Brussels 5
Curitiba 5
Dresden 5
Düsseldorf 5
New Taipei City 5
Pagani 5
Porto Alegre 5
Roubaix 5
São José do Rio Preto 5
Zurich 5
Augusta 4
Baku 4
Giugliano in Campania 4
Goiânia 4
Hyderabad 4
Hải Dương 4
Karachi 4
Manchester 4
Mumbai 4
Phuket 4
Quito 4
San Cipriano Picentino 4
Secaucus 4
Stockholm 4
Totale 3.991
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Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 171
Electrothermal aware design of multichip SiC-based converters for e-mobility 149
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 143
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 140
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 136
Influence of bumps height on electric field in double sided cooling power modules 132
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 132
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 130
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 129
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 129
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 126
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 125
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 124
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 124
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 124
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 122
Optimization of thermal vias design in PCB-based power circuits 121
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 117
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 117
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 116
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 116
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 116
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 115
Experimental validation of analytical models for through-PCB thermal vias 115
Diagnosis of power losses in PV plants by means of UAV thermography 114
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 113
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 111
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 111
Defect detection in double-sided cooled power modules by structure function 110
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 109
Study of the thermal behavior of double-sided cooled power modules 109
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 108
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 108
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 107
Evaluation of vertical mechanical displacement in SiC-based power modules 101
A priori error bound for moment matching approximants of thermal models 101
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 101
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 100
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 96
Thermal management solutions for a lightweight 3L GaN inverter 96
Determining the contribution of spatial sub-regions to structure functions 95
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 94
Validation of thermometer-based techniques to experimentally extract the impact of nonlinear thermal effects on the thermal resistance of bipolar transistors 92
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps 92
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 89
TCAD-based investigation of a 3.3 kV planar SiC MOSFET: BV-RON trade-off optimization 87
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 87
Boundary condition independent compact thermal models enhanced by contour elements 86
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 81
In-depth analysis of the electrical ruggedness of double-sided cooled power modules 81
Out-of-SOA performance in 3.3 kV SiC MOSFETs: Comparison between planar and quasi-planar trench 81
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study 79
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 79
Enhancing electrical ruggedness in double-sided cooled power modules 77
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 77
Fast error-bounded MOR-based approximation of heat conduction problems in electronics 77
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 77
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 73
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 72
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part II: Approaches based on intersection points 70
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 70
Optimum module design I: Electrothermal 69
Electro-thermal circuit models of PhotoVoltaic cells subjected to optical degradation phenomena 68
A technique for the in-situ experimental extraction of the thermal impedance of power devices 65
A cost-driven analysis of thermal performance in power modules 62
Structure curve representation of dynamic thermal multi-ports 60
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 54
Novel approach to the extraction of sparse nonlinear dynamic compact thermal multi-ports 46
The Hidden Short-Term Electro-Thermal–Optical Feedback Loop in Circuit-Level Modeling of PV Hot-Spots 20
Totale 6.924
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Categoria #
all - tutte 20.547
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 20.547
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202130 0 0 0 0 0 0 0 0 0 0 3 27
2021/2022204 3 0 0 3 7 7 22 29 4 1 34 94
2022/2023311 38 19 16 11 40 42 5 34 58 25 15 8
2023/2024396 14 42 85 38 103 5 14 10 9 8 51 17
2024/20251.917 82 132 8 15 51 101 144 140 138 129 700 277
2025/20263.811 464 312 670 516 555 211 290 300 282 211 0 0
Totale 6.924