IRIS
CASTELLAZZI, ALBERTO
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
NA - Nord America 488
EU - Europa 201
AS - Asia 145
AF - Africa 3
Continente sconosciuto - Info sul continente non disponibili 1
Totale 838
Salva come PNG Salva come JPEG
Nazione #
US - Stati Uniti d'America 482
IT - Italia 121
SG - Singapore 95
CN - Cina 33
NL - Olanda 26
IE - Irlanda 17
FI - Finlandia 14
DE - Germania 10
GB - Regno Unito 8
CA - Canada 6
JP - Giappone 5
MY - Malesia 3
ES - Italia 2
JO - Giordania 2
KR - Corea 2
MA - Marocco 2
PK - Pakistan 2
SE - Svezia 2
CI - Costa d'Avorio 1
EU - Europa 1
GE - Georgia 1
HK - Hong Kong 1
IN - India 1
PL - Polonia 1
Totale 838
Salva come PNG Salva come JPEG
Città #
Chandler 101
Singapore 74
Santa Clara 54
Naples 43
Ashburn 28
Fairfield 28
Amsterdam 26
Napoli 20
Des Moines 18
Lawrence 18
Boston 17
Millbury 17
Princeton 9
Dallas 8
Helsinki 8
Nanjing 7
Bristol 6
Ottawa 5
Puglianello 5
Acerra 4
Hebei 4
Milan 4
Wilmington 4
Beijing 3
Dearborn 3
Dublin 3
Falls Church 3
Kangar 3
Nanchang 3
Redwood City 3
Shenzhen 3
Amman 2
Aversa 2
Casablanca 2
Changsha 2
Kot Addu 2
Scafati 2
Serra 2
Tokyo 2
Toyonaka 2
Urnieta 2
Woodbridge 2
Bengaluru 1
Cava 1
Council Bluffs 1
Duncan 1
Empoli 1
Falkenstein 1
Fort St. James 1
Frankfurt am Main 1
Gragnano 1
Hong Kong 1
Indiana 1
Jiaxing 1
Jinan 1
Kyoto 1
Namdong-gu 1
Neubiberg 1
Norwalk 1
Nürnberg 1
Pago Veiano 1
Paliano 1
Rome 1
Sant'arpino 1
Shanghai 1
Shenyang 1
Springfield 1
Tbilisi 1
Tianjin 1
Torre Annunziata 1
Zhengzhou 1
Totale 583
Salva come PNG Salva come JPEG
Nome #
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 50
A comprehensive study of short-circuit ruggedness of silicon carbide power MOSFETs 48
SiC Power Module Design Performance, Robustness and Reliability 46
Short-circuit failure mechanism of SiC power MOSFETs 44
High-temperature validated SiC power MOSFET model for flexible robustness analysis of multi-chip structures 43
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 41
Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module 40
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 39
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 36
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 36
Influence of gate bias on the avalanche ruggedness of SiC power MOSFETs 34
SiC power MOSFETs performance, robustness and technology maturity 33
A comprehensive study on the avalanche breakdown robustness of silicon carbide power MOSFETs 33
Optimization of thermal vias design in PCB-based power circuits 33
Statistical Analysis of the Electrothermal Imbalances of Mismatched Parallel SiC Power MOSFETs 30
Influence of design parameters on the short-circuit ruggedness of SiC power MOSFETs 28
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 27
Influence of bumps height on electric field in double sided cooling power modules 27
Experimental validation of analytical models for through-PCB thermal vias 27
Evaluation of vertical mechanical displacement in SiC-based power modules 26
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 26
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 25
Single pulse avalanche robustness and repetitive stress ageing of SiC power MOSFETs 24
Transient out-of-SOA robustness of SiC power MOSFETs 24
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 24
Thermal management solutions for a lightweight 3L GaN inverter 20
Study of the thermal behavior of double-sided cooled power modules 20
Defect detection in double-sided cooled power modules by structure function 12
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 11
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 7
Totale 914
Salva come PNG Salva come JPEG
Categoria #
all - tutte 4.805
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 4.805
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202017 0 0 0 0 0 6 2 0 0 2 7 0
2020/202142 0 0 0 0 0 6 23 0 1 0 1 11
2021/2022137 0 0 3 2 3 3 13 9 15 1 13 75
2022/2023226 28 15 11 11 31 32 5 17 36 28 9 3
2023/2024174 16 25 40 27 16 0 3 4 4 4 19 16
2024/2025193 45 74 0 5 34 35 0 0 0 0 0 0
Totale 914