CASTELLAZZI, ALBERTO
 Distribuzione geografica
Continente #
AS - Asia 1.649
NA - Nord America 1.321
EU - Europa 873
SA - Sud America 180
AF - Africa 22
Continente sconosciuto - Info sul continente non disponibili 1
OC - Oceania 1
Totale 4.047
Nazione #
US - Stati Uniti d'America 1.263
SG - Singapore 766
RU - Federazione Russa 397
CN - Cina 349
VN - Vietnam 252
IT - Italia 178
BR - Brasile 143
HK - Hong Kong 81
FR - Francia 76
JP - Giappone 65
DE - Germania 61
KR - Corea 39
FI - Finlandia 34
NL - Olanda 33
GB - Regno Unito 31
CA - Canada 28
IE - Irlanda 20
MX - Messico 19
AR - Argentina 17
IN - India 16
BD - Bangladesh 9
ES - Italia 8
IQ - Iraq 8
TH - Thailandia 8
PK - Pakistan 7
PL - Polonia 7
ID - Indonesia 6
JO - Giordania 6
TW - Taiwan 6
EC - Ecuador 5
MA - Marocco 5
PH - Filippine 5
TR - Turchia 5
ZA - Sudafrica 5
AT - Austria 4
LT - Lituania 4
PY - Paraguay 4
SE - Svezia 4
AZ - Azerbaigian 3
CH - Svizzera 3
DK - Danimarca 3
LU - Lussemburgo 3
MY - Malesia 3
NP - Nepal 3
VE - Venezuela 3
AL - Albania 2
BE - Belgio 2
CI - Costa d'Avorio 2
CL - Cile 2
CO - Colombia 2
DO - Repubblica Dominicana 2
ET - Etiopia 2
OM - Oman 2
UA - Ucraina 2
UY - Uruguay 2
AU - Australia 1
BA - Bosnia-Erzegovina 1
BH - Bahrain 1
BW - Botswana 1
BZ - Belize 1
CR - Costa Rica 1
DM - Dominica 1
DZ - Algeria 1
EU - Europa 1
GE - Georgia 1
GY - Guiana 1
HN - Honduras 1
IR - Iran 1
KE - Kenya 1
KZ - Kazakistan 1
LA - Repubblica Popolare Democratica del Laos 1
MN - Mongolia 1
NG - Nigeria 1
NI - Nicaragua 1
PA - Panama 1
PE - Perù 1
PR - Porto Rico 1
PS - Palestinian Territory 1
RE - Reunion 1
SA - Arabia Saudita 1
SN - Senegal 1
SV - El Salvador 1
SY - Repubblica araba siriana 1
TN - Tunisia 1
TT - Trinidad e Tobago 1
TZ - Tanzania 1
UZ - Uzbekistan 1
Totale 4.047
Città #
Singapore 356
San Jose 178
Dallas 155
Hefei 121
Ashburn 117
Moscow 106
Chandler 105
Beijing 89
Ho Chi Minh City 79
Hong Kong 73
Naples 67
Hanoi 66
Santa Clara 60
Tokyo 57
Lauterbourg 42
Los Angeles 37
Fairfield 31
Seoul 31
Amsterdam 30
Boston 23
Napoli 21
Buffalo 20
Munich 20
Des Moines 19
Lawrence 19
Millbury 18
New York 18
Denver 17
The Dalles 17
Redondo Beach 16
Frankfurt am Main 13
Helsinki 12
Haiphong 11
Mexico City 11
Orem 11
São Paulo 11
Espoo 9
Houston 9
Montreal 9
Princeton 9
Biên Hòa 8
Da Nang 8
Düsseldorf 8
Milan 8
Seattle 8
Falkenstein 7
Nanjing 7
Phoenix 7
Puglianello 7
Rio de Janeiro 7
Amman 6
Bristol 6
Curitiba 6
Dublin 6
Poplar 6
Roubaix 6
Turku 6
Warsaw 6
Brooklyn 5
Casablanca 5
Hsinchu 5
London 5
Ottawa 5
San Juan 5
Wilmington 5
Acerra 4
Atlanta 4
Baghdad 4
Chennai 4
Council Bluffs 4
Hebei 4
Mumbai 4
Nanchang 4
Rome 4
Shenzhen 4
Toronto 4
Ankara 3
Augusta 3
Bacoli 3
Baku 3
Belo Horizonte 3
Boydton 3
Brasília 3
Chicago 3
Dearborn 3
Falls Church 3
Hangzhou 3
Johannesburg 3
Kangar 3
Luxembourg 3
Nuremberg 3
Phuket 3
Quito 3
Redwood City 3
Salvador 3
Serra 3
Thái Bình 3
Uberlândia 3
Vilnius 3
Addis Ababa 2
Totale 2.386
Nome #
A comprehensive study of short-circuit ruggedness of silicon carbide power MOSFETs 157
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 143
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 137
Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module 135
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 133
Influence of bumps height on electric field in double sided cooling power modules 132
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 131
Short-circuit failure mechanism of SiC power MOSFETs 128
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 125
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 124
Statistical Analysis of the Electrothermal Imbalances of Mismatched Parallel SiC Power MOSFETs 123
Optimization of thermal vias design in PCB-based power circuits 123
A comprehensive study on the avalanche breakdown robustness of silicon carbide power MOSFETs 116
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 116
Experimental validation of analytical models for through-PCB thermal vias 116
SiC Power Module Design Performance, Robustness and Reliability 115
Defect detection in double-sided cooled power modules by structure function 113
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 113
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 112
High-temperature validated SiC power MOSFET model for flexible robustness analysis of multi-chip structures 112
Influence of gate bias on the avalanche ruggedness of SiC power MOSFETs 110
SiC power MOSFETs performance, robustness and technology maturity 109
Study of the thermal behavior of double-sided cooled power modules 109
Influence of design parameters on the short-circuit ruggedness of SiC power MOSFETs 108
Transient out-of-SOA robustness of SiC power MOSFETs 106
Evaluation of vertical mechanical displacement in SiC-based power modules 103
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 97
Single pulse avalanche robustness and repetitive stress ageing of SiC power MOSFETs 97
Thermal management solutions for a lightweight 3L GaN inverter 97
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 95
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 89
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 80
Enhancing electrical ruggedness in double-sided cooled power modules 77
A cost-driven analysis of thermal performance in power modules 63
Aging and failure mechanisms of {SiC} {Power} {MOSFETs} under repetitive short- circuit pulses of different duration 56
α-Ga2O3 SBD switching performance in PFC application 54
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 54
Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode 50
Effect of gate-source bias voltage and gate-drain leakage current on the short-circuit performance of FTO-type SiC power MOSFETs 47
SiC MOSFETs soft and hard failure modes: functional analysis and structural characterization 41
Totale 4.146
Categoria #
all - tutte 12.398
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 12.398


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202116 0 0 0 0 0 0 0 0 0 0 2 14
2021/2022142 0 0 3 2 3 3 13 9 15 1 15 78
2022/2023234 29 16 13 11 31 33 5 17 37 30 9 3
2023/2024195 16 30 44 28 19 0 7 4 6 4 20 17
2024/20251.127 47 75 0 5 35 55 109 82 56 89 406 168
2025/20262.249 266 179 335 278 373 128 154 177 199 131 29 0
Totale 4.146